Verification of transmission line de‐embedding method for on‐chip spiral inductor based on electromagnetic simulation. (19th November 2015)

• Record Type: Journal Article
• Authors: Han, Bo; Song, Youcai; Wang, Zhongxin; Li, Jun; Shi, Xiaofeng
• Is Part Of: International journal of numerical modelling. Volume 29:Number 4(2016:Jul./Aug.)
• Page Start: 686
• Page End: 694
• Publication Date: 2015-11-19
• Subjects: de‐embedding -- on chip -- spiral inductor -- electromagnetic simulation -- open‐through pads; Electric networks -- Mathematical models -- Periodicals; Electronics -- Mathematical models -- Periodicals; 621.3011
• DOI: 10.1002/jnm.2124
• Languages: English
• ISSNs: 0894-3370

Abstract

Abstract: Accurate measurement data are a prerequisite for the equivalent circuit modeling of on‐chip devices. In this paper, the open and transmission line de‐embedding methods for on‐chip spiral inductors have been compared and analyzed by electromagnetic simulation with 130‐nm 1P6M BiCMOS process. Compared with the open de‐embedding technique, the characteristic impedances and propagation constants of left and right side ground‐signal‐ground probe pads can be directly determined by one through structure. Thus, these probe pads parasitic can be removed from the on‐wafer passives based on transmission line theory. These proposed de‐embedding techniques are validated by on‐chip spiral inductor with occupying areas of 280 × 280 µm 2 up to 40 GHz. Experiment results have excellent physical and theoretical trends. Copyright © 2015 John Wiley & Sons, Ltd.