Low-pressure Cu-Cu bonding using in-situ surface-modified microscale Cu particles for power device packaging. (15th July 2016)

• Record Type: Journal Article
• Authors: Liu, Xiangdong; Nishikawa, Hiroshi
• Is Part Of: Scripta materialia. Volume 120(2016)
• Page Start: 80
• Page End: 84
• Publication Date: 2016-07-15
• Subjects: Sintering -- Surface modification -- Copper -- Oxides -- Oxidation-reduction bonding; Materials -- Periodicals; Metallurgy -- Periodicals; Metalen; Legeringen; Materiaalkunde; Metals, metalworking and machinery industries; Metals; Electronic journals; 620.11
• DOI: 10.1016/j.scriptamat.2016.04.018
• Languages: English
• ISSNs: 1359-6462

Abstract

Abstract: An oxidation-reduction bonding (ORB) was applied to achieve Cu-Cu bonding with microscale Cu particle paste. During sintering at 300 °C, Cu2 O nanoparticles were homogeneously formed on the surface of the microscale Cu particles through a thermal oxidation, and were subsequently reduced to Cu nanotextured surface in formic acid atmosphere. This in-situ surface modification significantly enhances the sinterability of the microscale Cu particles, leading to a well-sintered microstructure and a three times higher bonding strength than that of the bonding joints prepared with non-oxidation bonding (NOB). Graphical abstract: