Transient response of a Mode III interface crack between piezoelectric layer and functionally graded orthotropic layer. (July 2016)

• Record Type: Journal Article
• Authors: Shin, Jeong Woo; Kim, Tae-Uk
• Is Part Of: International journal of solids and structures. Volume 90(2016)
• Page Start: 122
• Page End: 128
• Publication Date: 2016-07
• Subjects: Functionally graded orthotropic material (FGOM) -- Piezoelectric material -- Interface -- Crack -- Transient response -- Dynamic stress intensity factor (DSIF); Mechanics, Applied -- Periodicals; Structural analysis (Engineering) -- Periodicals; Elastic solids -- Periodicals; Mécanique appliquée -- Périodiques; Constructions, Théorie des -- Périodiques; Solides élastiques -- Périodiques; Elastic solids; Mechanics, Applied; Structural analysis (Engineering); Periodicals; 624.18
• DOI: 10.1016/j.ijsolstr.2016.03.033
• Languages: English
• ISSNs: 0020-7683

Abstract

Abstract: In this study, transient response analysis of a Mode III interface crack between a piezoelectric layer and a functionally graded orthotropic material (FGOM) layer is conducted using integral transform techniques. Material properties of the FGOM layer change continuously along the layer thickness and two layers are connected weak-discontinuously. Laplace and Fourier transforms are applied to solve the problem, and the problem is then expressed by a Fredholm integral equation of the second kind. It is found that the followings are beneficial to impede transient fracture of the interface crack between piezoelectric layer and FGOM layer: (a) an increase of shear moduli of the FGOM from the interface to the lower free surface; (b) an increase of the gradient of shear moduli, a decrease of ratio of shear moduli, the electric boundary condition EBC I of the piezoelectric layer in the case of increase of shear moduli of the FGOM from the interface to the lower free surface; (c) an increase of thickness of the layers.