Ultrarobust Thin‐Film Devices from Self‐Assembled Metal–Terpyridine Oligomers. Issue 18 (10th March 2016)

• Record Type: Journal Article
• Authors: Karipidou, Zoi; Branchi, Barbara; Sarpasan, Mustafa; Knorr, Nikolaus; Rodin, Vadim; Friederich, Pascal; Neumann, Tobias; Meded, Velimir; Rosselli, Silvia; Nelles, Gabriele; Wenzel, Wolfgang; Rampi, Maria Anita; von Wrochem, Florian
• Is Part Of: Advanced materials. Volume 28:Issue 18(2016)
• Page Start: 3473
• Page End: 3480
• Publication Date: 2016-03-10
• Subjects: thin‐film devices -- large‐area junctions -- thermionic emission -- transition‐metal complexes -- Schottky contacts -- molecular electronics; Materials -- Periodicals; Chemical vapor deposition -- Periodicals; 620.11
• DOI: 10.1002/adma.201504847
• Languages: English
• ISSNs: 0935-9648

Abstract

Abstract : Ultrathin molecular layers of Fe II ‐terpyridine oligomers allow the fabrication of large‐area crossbar junctions by conventional electrode vapor deposition. The junctions are electrically stable for over 2.5 years and operate over a wide range of temperatures (150–360 K) and voltages (±3 V) due to the high cohesive energy and packing density of the oligomer layer. Electrical measurements reveal ideal Richardson–Shottky emission in surprising agreement with electrochemical, optical, and photoemission data.