Thermal stresses in a coating–substrate assembly caused by internal heat source. Issue 1 (2nd January 2016)

• Record Type: Journal Article
• Authors: Elperin, T.; Rudin, G.
• Is Part Of: Journal of thermal stresses. Volume 39:Issue 1(2016)
• Page Start: 90
• Page End: 102
• Publication Date: 2016-01-02
• Subjects: Coating -- laser heating -- thermal stresses -- reliability testing; Thermal stresses -- Periodicals; 620.1121
• DOI: 10.1080/01495739.2015.1123594
• Languages: English
• ISSNs: 0149-5739

Abstract

ABSTRACT: We determine two-dimensional temperature and thermal stresses distributions in a semiconductor coating-substrate assembly caused by the heat source at the contact surface. The analysis is based on the Laplace and Hankel integral transforms of equations of thermal elasticity, and the obtained analytical solutions can be used without any limitations on the duration of heating, the thickness of a coating, mechanical and thermal characteristics of materials. We consider the effect of the thickness of a coating, thermal mismatch between the substrate and the coating on the magnitude of thermal stresses. Using the obtained thermal stress distribution we analyze the delamination failure at the substrate-coating interface.