Approaching Gas Phase Electrodeposition: Process and Optimization to Enable the Self‐Aligned Growth of 3D Nanobridge‐Based Interconnects. Issue 9 (21st December 2015)

• Record Type: Journal Article
• Authors: Fang, Jun; Schlag, Leslie; Park, Se‐Chul; Stauden, Thomas; Pezoldt, Jörg; Schaaf, Peter; Jacobs, Heiko O.
• Is Part Of: Advanced materials. Volume 28:Issue 9(2016)
• Page Start: 1770
• Page End: 1779
• Publication Date: 2015-12-21
• Subjects: electrodeposition -- nanobridge‐based interconnects -- self‐aligned nanowires -- self‐assembly; Materials -- Periodicals; Chemical vapor deposition -- Periodicals; 620.11
• DOI: 10.1002/adma.201503039
• Languages: English
• ISSNs: 0935-9648

Abstract

Abstract : A nanowire bonding process referred to as gas‐phase electrodeposition is reported to form nanobridge‐based interconnects. The process is able to grow free‐standing point‐to‐point electrical connections using metallic wires. As a demonstration, programmable interconnects and an interdigitated electrode array are shown. The process is more material efficient when compared with conventional vapor deposition since the material is directed to the point of use.