Corrigendum to "Thermal stability of Cu–Nb microcomposite wires" [Acta Mater. 101 (2015) 181–188]. (15th February 2016)

Record Type:: Journal Article
Title:: Corrigendum to "Thermal stability of Cu–Nb microcomposite wires" [Acta Mater. 101 (2015) 181–188]. (15th February 2016)
Main Title:: Corrigendum to "Thermal stability of Cu–Nb microcomposite wires" [Acta Mater. 101 (2015) 181–188]
Authors:: Deng, Liping
Han, Ke
Wang, Bingshu
Yang, Xiaofang
Liu, Qing
Abstract:
Is Part Of:: Acta materialia. Volume 105(2016)
Journal:: Acta materialia
Issue:: Volume 105(2016)
Issue Display:: Volume 105, Issue 2016 (2016)
Year:: 2016
Volume:: 105
Issue:: 2016
Issue Sort Value:: 2016-0105-2016-0000
Page Start:: 519
Page End:
Publication Date:: 2016-02-15
Subjects:: Materials -- Periodicals
Materials science -- Periodicals
Materials -- Mechanical properties -- Periodicals
Metallurgy -- Periodicals
Chemistry, Inorganic -- Periodicals
620.112
Journal URLs:: http://www.sciencedirect.com/science/journal/13596454 ↗
http://www.elsevier.com/journals ↗
DOI:: 10.1016/j.actamat.2015.12.031 ↗
Languages:: English
ISSNs:: 1359-6454
Deposit Type:: Legaldeposit
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗
Physical Locations:: British Library DSC - 0629.920000
British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store
Ingest File:: 1728.xml