Effect of Ce on resistivity of Sn-3.8Ag-0.7Cu-xCe lead-free solders. (2nd January 2016)

• Record Type: Journal Article
• Authors: Zhai, Wengang; Zhao, Xuemei; Li, Xianfen; Fan, Manjie; Xu, Xinhou; Wang, Xi; Kang, Zejun; Zhou, Wei
• Is Part Of: Physics and chemistry of liquids. Volume 54:Number 1(2016)
• Page Start: 37
• Page End: 41
• Publication Date: 2016-01-02
• Subjects: Sn-3.8Ag-0.7Cu-xCe -- electrical resistivity -- structure transition -- rare earth -- lead-free solder; Liquids -- Periodicals; 530.4205
• DOI: 10.1080/00319104.2015.1058941
• Languages: English
• ISSNs: 0031-9104

Abstract

Abstract: The electrical resistivity of Sn-3.8Ag-0.7Cu- x Ce ( x takes 0, 0.2, 0.5 and 1.0 weight per cent) alloy as a function of temperature was measured by DC four-probe technique. Abnormal changes occurred on the resistivity–temperature ( ρ – T ) curves above the liquidus, which suggested that the temperature-induced liquid–liquid structure transition probably occurred in Sn-3.8Ag-0.7Cu- x Ce melt, with some reversible characters. With the increasing of Ce, the melting range was expanded from 13.0°C to 24.2°C, and the resistivity increased sharply when the Ce composition increased to 0.2%, and then declined slightly. In addition, the temperature and behaviour of abnormal zone were affected by the different additions of Ce.