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Fan 樊, S. et al. (n.d.). A quantitative investigation of the influence with the components of the CMP alkali slurry on the polishing rate*Project supported by the Special Project Items No. 2 in National Long-Term Technology Development Plan, China (No. 2009ZX02308) and the Natural Science Foundation of Hebei Province, China (No. F2013202104).. Journal of semiconductors. p. . [Online].