Development of particle dispersion technique for hybrid size conductivity model. Issue 1 (11th November 2015)

• Record Type: Journal Article
• Authors: Zulkarnain, M.; Fadzil, M. A.; Abu Bakar, Husaini; Mariatti, M.; Azid, I.
• Is Part Of: Asia-Pacific journal of chemical engineering. Volume 11:Issue 1(2016:Jan./Feb.)
• Page Start: 124
• Page End: 139
• Publication Date: 2015-11-11
• Subjects: particle dispersion -- van der Waals -- critical distance -- electrical conductivity -- hybrid size particles; Chemical engineering -- Periodicals; 660
• DOI: 10.1002/apj.1950
• Languages: English
• ISSNs: 1932-2135

Abstract

Abstract: This paper presents a new approach in modeling the particle dispersion structure of micro‐nano silver particles of conductive adhesive considering the van der Waals interaction energy. As there are many possible combinations of hybrid micro‐nano system, this work only focuses on two types of micro‐nanoparticles interconnecting; the first is single microparticles with nanoparticles, and the second is two microparticles with nanoparticles. The particle coordinates were imported intocad software to produce 3D geometry, and finally, the finite element method was used to determine the electrical conductivity. The experimental data were taken at the volume ratios of the hybrid system using micro‐sized and nano‐sized particles at 50 : 50 for validation purpose. As a result, the predicted electrical conductivity shows a good agreement with experiment data with error less than 4%. Simulation result gives a value 1.46 × 10 1, 9.18, 6.86 and 4.54 S/cm for single‐micro/50 nanoparticles, single‐micro/75 nanoparticles, single‐micro/100 nanoparticles and single‐micro/125 nanoparticles, respectively. The electrical conductivity is optimum in a particular nano‐size number as it could settle interconnection path in shorter particle chain. The electrical conductivity show decreasing by increasing particle network chain due to nano‐particles added. © 2015 Curtin University of Technology and John Wiley & Sons, Ltd.