Impulse Pressuring Diffusion Bonding of Titanium to Stainless Steel Using a Copper Interlayer. Issue 5 (May 2015)

• Record Type: Journal Article
• Authors: Yongqiang, Deng; Guangmin, Sheng; Lijing, Yin
• Is Part Of: Xi you jin shu cai liao yu gong cheng. Volume 44:Issue 5(2015)
• Page Start: 1041
• Page End: 1045
• Publication Date: 2015-05
• Subjects: Nonferrous metals -- Periodicals; 669.05
• DOI: 10.1016/S1875-5372(15)30063-1
• Languages: English
• ISSNs: 1875-5372

Abstract

<abstract abstract-type="author" id="ceab10"> <title id="cestitle10">Abstract</title> <sec> <p id="spara10">Impulse pressuring diffusion bonding of commercially pure titanium to 1Cr18Ni9 stainless steel was carried out using a copper interlayer in an attempt to reduce the bonding time and alleviate the detrimental effect of interfacial reaction products on bonding strength. Successful bonding has been achieved at 850 °C under a pulsed pressure of 8∼20 MPa within a duration of only 120∼180 s, which is notably shortened in comparison with conventional diffusion bonding. Microstructure characterization revealed that a sequence of Ti-Cu intermetallic compounds were formed at the Ti/Cu interface and the Cu/stainless steel interface was characterized by the presence of solid solution of Cu in <italic>γ</italic> Fe without any interfacial reaction products. Maximum bonding strength of 346 MPa was obtained when the joint was bonded for 120 s. Upon tensile loading, the joints fractured along the Ti/Cu interfacial reaction layer in a brittle cleavage manner, indicating that the impulse pressuring diffusion bonding can alleviate the harmful influence of interfacial intermetallic compounds on joint performances to a certain extent, but it is infeasible in completely eliminating the negative effect of the brittle intermetallic compounds.</p> </sec> </abstract>