Does active application of universal adhesives to enamel in self-etch mode improve their performance?. Issue 9 (September 2015)

• Record Type: Journal Article
• Authors: Loguercio, Alessandro D.; Muñoz, Miguel Angel; Luque-Martinez, Issis; Hass, Viviane; Reis, Alessandra; Perdigão, Jorge
• Is Part Of: Journal of dentistry. Volume 43:Issue 9(2015:Sep.)
• Page Start: 1060
• Page End: 1070
• Publication Date: 2015-09
• Subjects: Dentistry -- Periodicals; Dentistry -- Periodicals; Dentisterie -- Périodiques; Electronic journals; 617.6005
• DOI: 10.1016/j.jdent.2015.04.005
• Languages: English
• ISSNs: 0300-5712

Abstract

<abstract abstract-type="author" id="abs0005"> <title id="sect0005">Abstract</title> <sec> <title id="sect0010">Objectives</title> <p id="spar0005">To evaluate the effect of adhesion strategy on the enamel microshear bond strengths (μSBS), etching pattern, and in situ degree of conversion (DC) of seven universal adhesives.</p> </sec> <sec> <title id="sect0015">Methods</title> <p id="spar0010">84 extracted third molars were sectioned in four parts (buccal, lingual, proximal) and divided into 21 groups, according to the combination of the main factors adhesive (AdheSE Universal [ADU], All-Bond Universal [ABU], Clearfil Universal [CFU], Futurabond U [FBU], G-Bond Plus [GBP], Prime&Bond Elect (PBE), and Scotchbond Universal Adhesive [SBU]), and adhesion strategy (etch-and-rinse, active self-etch, and passive self-etch). Specimens were stored in water (37 °C/24 h) and tested at 1.0 mm/min (μSBS). Enamel–resin interfaces were evaluated for DC using micro-Raman spectroscopy. The enamel-etching pattern was evaluated under a field-emission scanning electron microscope (direct and replica techniques). Data were analyzed with two-way ANOVA and Tukey's test (<italic>α</italic> = 0.05).</p> </sec> <sec> <title id="sect0020">Results</title> <p id="spar0015">Active self-etch application increased μSBS and DC for five out of the seven universal adhesives when compared to passive application (<italic>p</italic> < 0.001). A deeper enamel-etching pattern was observed for all universal adhesives in the etch-and-rinse strategy. A slight improvement in etching ability was observed in active self-etch application compared to that of passive self-etch application. Replicas of GBP and PBE applied in active self-etch mode displayed morphological features compatible with water droplets. The DC of GBP and PBE were not affected by the application/strategy mode.</p> </sec> <sec> <title id="sect0025">Conclusions</title> <p id="spar0020">In light of the improved performance of universal adhesives when applied actively in SE mode, selective enamel etching with phosphoric acid may not be crucial for their adhesion to enamel.</p> </sec> <sec> <title id="sect0030">Clinical significance</title> <p id="spar0065">The active application of universal adhesives in self-etch mode may be a practical alternative to enamel etching in specific clinical situations.</p> </sec> </abstract>