Cite
HARVARD Citation
Tian, Y. et al. (2015). The size effect on intermetallic microstructure evolution of critical solder joints for flip chip assemblies. Soldering & surface mount technology. 27 (4), pp. 178-184. [Online].
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Tian, Y. et al. (2015). The size effect on intermetallic microstructure evolution of critical solder joints for flip chip assemblies. Soldering & surface mount technology. 27 (4), pp. 178-184. [Online].