A cupronickel-based micromesh film for use as a high-performance and low-voltage transparent heater1. Issue 32 (28th August 2015)

• Record Type: Journal Article
• Authors: Kim, Han-Jung; Kim, Yoonkap; Jeong, Jun-Ho; Choi, Jun-Hyuk; Lee, Jihye; Choi, Dae-Geun
• Is Part Of: Journal of materials chemistry. Volume 3:Issue 32(2015)
• Page Start: 16621
• Page End: 16626
• Publication Date: 2015-08-28
• Subjects: Materials -- Research -- Periodicals; Chemistry, Analytic -- Periodicals; Environmental sciences -- Research -- Periodicals; 543.0284
• DOI: 10.1039/c5ta03348a
• Languages: English
• ISSNs: 2050-7488

Abstract

<abstract abstract-type="toc"> <title> <x xml:space="preserve">Abstract</x> </title> <p> <graphic position="anchor" id="ga" xlink:href="ark:/27927/pgj2ds79fxg" xlink:type="simple" xmlns:xlink="http://www.w3.org/1999/xlink" />Uniformly interconnected CuNi mesh film was prepared by using a simple transfer printing method. The CuNi mesh films showed excellent heating performances, which reached a maximum steady-state temperature of 225 °C in 60 s, with respect to applied low-voltage (9 V), and better thermal stability than that of the pure Cu mesh film.</p> </abstract>