Gecko gaskets for self-sealing and high-strength reversible bonding of microfluidics1. Issue 13 (7th July 2015)

• Record Type: Journal Article
• Authors: Wasay, A.; Sameoto, D.
• Is Part Of: Lab on a chip. Volume 15:Issue 13(2015)
• Page Start: 2749
• Page End: 2753
• Publication Date: 2015-07-07
• Subjects: Miniature electronic equipment -- Periodicals; Combinatorial chemistry -- Periodicals; Biotechnology -- Periodicals; 543.0813
• DOI: 10.1039/c5lc00342c
• Languages: English
• ISSNs: 1473-0197

Abstract

<abstract abstract-type="toc"> <title> <x xml:space="preserve">Abstract</x> </title> <p> <graphic position="anchor" id="ga" xlink:href="ark:/27927/pgj1zk531f0" xlink:type="simple" xmlns:xlink="http://www.w3.org/1999/xlink" />We report a novel reversible bonding method for microfluidic devices using gecko-inspired dry adhesives that result in an instant high-strength bond suitable for pressure driven flows. The concept also provides for viable stick and play interconnections.</p> </abstract>