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HARVARD Citation
Adamshick, S. et al. (2015). Experimental characterization of coaxial through silicon vias for 3D integration. Microelectronics journal. 46 (5), pp. 377-382. [Online].
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Adamshick, S. et al. (2015). Experimental characterization of coaxial through silicon vias for 3D integration. Microelectronics journal. 46 (5), pp. 377-382. [Online].