Internal stress control of transition-metal thin films. (May 2015)

• Record Type: Journal Article
• Authors: Toyoda, R.; Tawata, M.; Hashimoto, M.; Matsumura, Y.
• Is Part Of: Materials research innovations. Volume 19:Number 5(2015)
• Page Start: S5-325
• Page End: S5-327
• Publication Date: 2015-05
• Subjects: Materials -- Research -- Periodicals; Matériaux -- Recherche -- Périodiques; 620.1105
• DOI: 10.1179/1432891714Z.0000000001103
• Languages: German
• ISSNs: 1432-8917

Abstract

<abstract> <title> <x content-type="archive" xml:space="preserve">Abstract</x> </title> <p>The characteristics of sputtered thin films are affected by ion bombardment during sputter deposition. An ion bombardment parameter <italic>P</italic>_i, which is based on the magnitude of the ion momentum and the impingement ratio of ions to metal particles, has been previously proposed as a means of expressing the effects of ion bombardment. In this study, the effects of ion bombardment parameter <italic>P</italic>_i on the internal stress of thin films were evaluated. Consequently, the internal stress of Ni and Cu thin films were observed to increase linearly with the increase of <italic>P</italic>_i; however, a Mo thin film exhibited the converse result. The results presented herein indicate that the characteristics of thin films, irrespective of the target, can be controlled via manipulation of parameter <italic>P</italic>_i.</p> </abstract>