Systems for locally resolved measurements of physical loads in manufacturing processes. Issue 1 (2015)

• Record Type: Journal Article
• Authors: Tausendfreund, A.; Stöbener, D.; Dumstorff, G.; Sarma, M.; Heinzel, C.; Lang, W.; Goch, G.
• Is Part Of: CIRP annals. Volume 64:Issue 1(2015)
• Page Start: 495
• Page End: 498
• Publication Date: 2015
• Subjects: Production engineering -- Research -- Periodicals; 670.5
• DOI: 10.1016/j.cirp.2015.03.005
• Languages: English
• ISSNs: 0007-8506

Abstract

<abstract abstract-type="author" id="abs0005"> <title id="sect0005">Abstract</title> <sec> <p id="spar0005">The generation of desired surface layer properties by a certain manufacturing process requires a comprehensive knowledge of the physical loads during the process and their influences on the workpiece material. This paper presents the setup and results of two in-process measurement systems, which are specifically designed to locally determine temperature and strain in several processes (in this case: grinding and deep rolling). One measuring system is based on speckle interference effects (speckle photography) detecting the deformation distribution of the workpiece surface and the other applies resistance deviation measurements of integrated thin films inside the near-surface layer to determine temperature and strain variations.</p> </sec> </abstract>