A laser assisted hybrid process chain for high removal rate machining of sintered silicon nitride. Issue 1 (2015)

• Record Type: Journal Article
• Authors: Fortunato, Alessandro; Guerrini, Giacomo; Melkote, Shreyes N.; Bruzzone, Alessandro A.G.
• Is Part Of: CIRP annals. Volume 64:Issue 1(2015)
• Page Start: 189
• Page End: 192
• Publication Date: 2015
• Subjects: Production engineering -- Research -- Periodicals; 670.5
• DOI: 10.1016/j.cirp.2015.04.033
• Languages: English
• ISSNs: 0007-8506

Abstract

<abstract abstract-type="author" id="abs0005"> <title id="sect0005">Abstract</title> <sec> <p id="spar0005">This paper presents a hybrid process chain for efficiently machining hard silicon nitride. The process includes a laser treatment phase to weaken the material, followed by diamond grinding. Optimized laser parameters have been identified to control the generation of a network of cracks that weakens the volume of material to be ground. Comparison of data between traditional and hybrid process chain shows a reduction in grinding force of about thirty per cent in the latter case. A finite element model has been developed for the analysis of thermal stresses generated by laser exposure and the prediction of crack formation.</p> </sec> </abstract>