Physical, chemical, and in vitro toxicological characterization of nanoparticles in chemical mechanical planarization suspensions used in the semiconductor industry: towards environmental health and safety assessments1. Issue 3 (5th June 2015)

• Record Type: Journal Article
• Authors: Speed, David; Westerhoff, Paul; Sierra-Alvarez, Reyes; Draper, Rockford; Pantano, Paul; Aravamudhan, Shyam; Chen, Kai Loon; Hristovski, Kiril; Herckes, Pierre; Bi, Xiangyu; Yang, Yu; Zeng, Chao; Otero-Gonzalez, Lila; Mikoryak, Carole; Wilson, Blake A.; Kosaraju, Karshak; Tarannum, Mubin; Crawford, Steven; Yi, Peng; Liu, Xitong; Babu, S. V.; Moinpour, Mansour; Ranville, James; Montano, Manuel; Corredor, Charlie; Posner, Jonathan; Shadman, Farhang
• Is Part Of: Environmental science. Volume 2:Issue 3(2015)
• Page Start: 227
• Page End: 244
• Publication Date: 2015-06-05
• Subjects: Environmental sciences -- Periodicals; Nanotechnology -- Periodicals; 620.505
• DOI: 10.1039/c5en00046g
• Languages: English
• ISSNs: 2051-8153

Abstract

<abstract abstract-type="toc"> <title> <x xml:space="preserve">Abstract</x> </title> <p> <graphic position="anchor" id="ga" xlink:href="ark:/27927/pgj1015xtdp" xlink:type="simple" xmlns:xlink="http://www.w3.org/1999/xlink" />This tutorial review focuses on aqueous slurries of dispersed engineered nanoparticles (ENPs) used in chemical mechanical planarization (CMP) for polishing wafers during manufacturing of semiconductors.</p> </abstract>