Thin Film Thermoelectric Metal–Organic Framework with High Seebeck Coefficient and Low Thermal Conductivity. (28th April 2015)

• Record Type: Journal Article
• Authors: Erickson, Kristopher J.; Léonard, François; Stavila, Vitalie; Foster, Michael E.; Spataru, Catalin D.; Jones, Reese E.; Foley, Brian M.; Hopkins, Patrick E.; Allendorf, Mark D.; Talin, A. Alec
• Is Part Of: Advanced materials. Volume 27:Number 22(2015)
• Page Start: 3453
• Page End: 3459
• Publication Date: 2015-04-28
• Subjects: Materials -- Periodicals; Chemical vapor deposition -- Periodicals; 620.11
• DOI: 10.1002/adma.201501078
• Languages: English
• ISSNs: 0935-9648

Abstract

<abstract abstract-type="graphical" xml:lang="en" id="adma201501078-abs-0001"> <title> <x xml:space="preserve">Abstract</x> </title> <p> <bold>A new thermoelectric material</bold> with high Seebeck coefficient and low thermal conductivity is demonstrated based on an electrically conducting metal–organic framework (MOF) using the guest@MOF concept. This demonstration opens a new avenue for the future development of thermoelectric materials. <graphic position="anchor" mimetype="image" xlink:href="ark:/27927/pgjrk4h0mb" orientation="portrait" xlink:type="simple" xmlns:xlink="http://www.w3.org/1999/xlink" /></p> </abstract>