Cite
HARVARD Citation
Dong, M. et al. (2015). 3D system-in-package design using stacked silicon submount technology. Microelectronics international. 32 (2), pp. 63-72. [Online].
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Dong, M. et al. (2015). 3D system-in-package design using stacked silicon submount technology. Microelectronics international. 32 (2), pp. 63-72. [Online].