Ultrasonic welding for fast bonding of self-aligned structures in lab-on-a-chip systems1. Issue 9 (7th May 2015)

• Record Type: Journal Article
• Authors: Kistrup, K.; Poulsen, C. E.; Hansen, M. F.; Wolff, A.
• Is Part Of: Lab on a chip. Volume 15:Issue 9(2015)
• Page Start: 1998
• Page End: 2001
• Publication Date: 2015-05-07
• Subjects: Miniature electronic equipment -- Periodicals; Combinatorial chemistry -- Periodicals; Biotechnology -- Periodicals; 543.0813
• DOI: 10.1039/c5lc00174a
• Languages: English
• ISSNs: 1473-0197

Abstract

<abstract abstract-type="toc"> <title> <x xml:space="preserve">Abstract</x> </title> <p> <graphic position="anchor" id="ga" xlink:href="ark:/27927/pgjn28gq15" xlink:type="simple" xmlns:xlink="http://www.w3.org/1999/xlink" />We demonstrate ultrasonic welding for (1) self-aligned gapless bonding of a two-part lab-on-a-chip system and for (2) bonding of a large area shallow chamber. Combining injection moulding using micromilled shims with ultrasonic welding, we can go from design to a batch of chips within a single day. The chips are mass-producible with a total production time of 60 s per chip.</p> </abstract>