Deposition of Wafer‐Scale Single‐Component and Binary Nanocrystal Superlattice Thin Films Via Dip‐Coating. (27th March 2015)

• Record Type: Journal Article
• Authors: Gaulding, E. Ashley; Diroll, Benjamin T.; Goodwin, E. D.; Vrtis, Zachary J.; Kagan, Cherie R.; Murray, Christopher B.
• Is Part Of: Advanced materials. Volume 27:Number 18(2015)
• Page Start: 2846
• Page End: 2851
• Publication Date: 2015-03-27
• Subjects: Materials -- Periodicals; Chemical vapor deposition -- Periodicals; 620.11
• DOI: 10.1002/adma.201405575
• Languages: English
• ISSNs: 0935-9648

Abstract

<abstract abstract-type="graphical" xml:lang="en" id="adma201405575-abs-0001"> <title> <x xml:space="preserve">Abstract</x> </title> <p> <bold>Single‐component and binary nanocrystal superlattices</bold> are assembled over wafer‐scale areas using the dip‐coating method. A series of measurements are performed to confirm superlattice assembly. This study demonstrates the versatility of dip‐coating in depositing a diverse set of nanocrystal materials and superlattice structures, while combining large‐area deposition with nanoscale control. <graphic position="anchor" mimetype="image" xlink:href="ark:/27927/pgjkxzgzcs" orientation="portrait" xlink:type="simple" xmlns:xlink="http://www.w3.org/1999/xlink" /></p> </abstract>