In vitro burn model illustrating heat conduction patterns using compressed thermal papers. Issue 1 (26th February 2015)

• Record Type: Journal Article
• Authors: Lee, Jun Yong; Jung, Sung‐No; Kwon, Ho
• Is Part Of: Wound repair and regeneration. Volume 23:Issue 1(2015)
• Page Start: 124
• Page End: 131
• Publication Date: 2015-02-26
• Subjects: Wound healing -- Periodicals; Regeneration (Biology) -- Periodicals; 617.14
• DOI: 10.1111/wrr.12240
• Languages: English
• ISSNs: 1067-1927

Abstract

<abstract abstract-type="main"> <title>Abstract</title> <p>To date, heat conduction from heat sources to tissue has been estimated by complex mathematical modeling. In the present study, we developed an intuitive in vitro skin burn model that illustrates heat conduction patterns inside the skin. This was composed of tightly compressed thermal papers with compression frames. Heat flow through the model left a trace by changing the color of thermal papers. These were digitized and three‐dimensionally reconstituted to reproduce the heat conduction patterns in the skin. For standardization, we validated K91HG‐CE thermal paper using a printout test and bivariate correlation analysis. We measured the papers' physical properties and calculated the estimated depth of heat conduction using Fourier's equation. Through contact burns of 5, 10, 15, 20, and 30 seconds on porcine skin and our burn model using a heated brass comb, and comparing the burn wound and heat conduction trace, we validated our model. The heat conduction pattern correlation analysis (intraclass correlation coefficient: 0.846, <italic>p</italic> &lt; 0.001) and the heat conduction depth correlation analysis (intraclass correlation coefficient: 0.93, <italic>p</italic> &lt; 0.001) showed statistically significant high correlations between the porcine burn wound and our model. Our model showed good correlation with porcine skin burn injury and replicated its heat conduction patterns.</p> </abstract>