Cite
HARVARD Citation
Lorival, J. et al. (2015). An efficient and simple compact modeling approach for 3-D interconnects with IC׳s stack global electrical context consideration. Microelectronics journal. 46 (2), pp. 153-165. [Online].
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Lorival, J. et al. (2015). An efficient and simple compact modeling approach for 3-D interconnects with IC׳s stack global electrical context consideration. Microelectronics journal. 46 (2), pp. 153-165. [Online].