Precursor-based designs of nano-structures and their processing for Co(W) alloy films as a single layered barrier/liner layer in future Cu-interconnect1. Issue 11 (21st March 2015)

• Record Type: Journal Article
• Authors: Shimizu, H.; Shima, K.; Suzuki, Y.; Momose, T.; Shimogaki, Y.
• Is Part Of: Journal of materials chemistry. Volume 3:Issue 11(2015)
• Page Start: 2500
• Page End: 2510
• Publication Date: 2015-03-21
• Subjects: Materials -- Periodicals; Chemistry, Analytic -- Periodicals; Optical materials -- Research -- Periodicals; Electronics -- Materials -- Research -- Periodicals; 543.0284
• DOI: 10.1039/c4tc01088d
• Languages: English
• ISSNs: 2050-7526

Abstract

<abstract abstract-type="toc"> <title> <x xml:space="preserve">Abstract</x> </title> <p> <graphic position="anchor" id="ga" xlink:href="ark:/27927/pgjbfztp9n" xlink:type="simple" xmlns:xlink="http://www.w3.org/1999/xlink" />We designed Co(W) films with the self-assembled grain-boundary stuffing as a single-layer barrier/liner for future ULSI Cu-interconnects. HR-TEM and EDX observations confirmed the validity of our materials design and good barrier performance in Co(W) films.</p> </abstract>