Evaluation of a Single Cell and Candidate Materials with High Water Content Hydrogen in a Generic Solid Oxide Fuel Cell Stack Test Fixture, Part II: Materials and Interface Characterization. Issue 1 (15th February 2012)

• Record Type: Journal Article
• Authors: Chou, Yeong‐Shyung; Stevenson, Jeffry W.; Choi, Jung‐Pyung
• Is Part Of: International journal of applied ceramic technology. Volume 10:Issue 1(2013:Jan./Feb.)
• Page Start: 97
• Page End: 106
• Publication Date: 2012-02-15
• Subjects: Ceramics -- Periodicals; Ceramics -- Technological innovations -- Periodicals; 620.1405
• DOI: 10.1111/j.1744-7402.2012.02753.x
• Languages: English
• ISSNs: 1546-542X

Abstract

<abstract abstract-type="main" id="ijac02753-abs-0001"> <title> <x xml:space="preserve">Abstract</x> </title> <p>A generic solid oxide fuel cell (SOFC) test fixture was developed to evaluate candidate materials under realistic operating conditions. A commercial 50 mm × 50 mm NiO‐YSZ anode‐supported thin YSZ electrolyte cell with lanthanum strontium manganite (LSM)/YSZ cathode was tested to evaluate the stability of candidate materials. The cell was tested in two stages at 800°C: stage I with low (~3% H₂O) humidity and stage II with high (~30% H₂O) humidity hydrogen fuel in constant voltage or constant current mode. Part I of the work, published previously, provided information regarding the generic test fixture design, materials, cell performance, and optical post‐mortem analysis. In part II, detailed microstructure and interfacial characterizations are reported regarding the SOFC candidate materials: (Mn, Co)‐spinel conductive coating, alumina coating for sealing area, ferritic stainless steel interconnect, refractory sealing glass, and their interactions with each other. Overall, the (Mn, Co)‐spinel coating was very effective in minimizing Cr migration. No Cr was identified in the cathode after 1720 h at 800°C. Aluminization of metallic interconnects also proved to be chemically compatible with alkaline‐earth silicate sealing glass. The details of interfacial reaction and microstructure development are discussed.</p> </abstract>