Low‐Temperature Sintered NTC Thermistor Ceramics for Thick‐Film Temperature Sensors. Issue 3 (21st February 2013)

• Record Type: Journal Article
• Authors: Reimann, Timmy; Töpfer, Jörg; Barth, Stefan; Bartsch, Heike; Müller, Jens
• Is Part Of: International journal of applied ceramic technology. Volume 10:Issue 3(2013:May/Jun.)
• Page Start: 428
• Page End: 434
• Publication Date: 2013-02-21
• Subjects: Ceramics -- Periodicals; Ceramics -- Technological innovations -- Periodicals; 620.1405
• DOI: 10.1111/ijac.12045
• Languages: English
• ISSNs: 1546-542X

Abstract

<abstract abstract-type="main" id="ijac12045-abs-0001"> <title> <x xml:space="preserve">Abstract</x> </title> <p>Negative temperature coefficient (NTC) thermistor thick films were fabricated by screen printing on alumina substrates and firing at 900°C. Spinel‐type NiMn₂O₄ exhibits limited stability in air between 730 and 970°C only and interacts with the Bi₂O₃ additive. The Zn–Co‐substituted spinel Zn_0.75Ni_0.5Co_0.5Mn_1.25O₄ with 3 wt% additive shows complete densification at 900°C; no interaction between spinel and additive was observed. Alternatively, a Cu–Zn–Co‐substituted Cu_0.37Zn_0.52Ni_0.44Co_0.44Mn_1.23O₄ spinel with excellent sintering characteristics even without sintering additive was investigated. The thermistor films display a sheet resistance of about 300 kΩ/□ and B = 3300 K. The firing behavior, microstructure formation, and electrical properties of NTC thick films are reported.</p> </abstract>