Transient liquid phase diffusion bonding of Al/Al2O3 nanostructured metal matrix composites. (October 2014)

• Record Type: Journal Article
• Authors: Yarahmadi, M.; Shamanian, M.; Salimi Jazi, H. R.; Hoshyarmanesh, H. R.
• Is Part Of: Science and technology of welding & joining. Volume 19:Number 7(2014:Oct.)
• Page Start: 603
• Page End: 608
• Publication Date: 2014-10
• Subjects: Welding -- Periodicals; Joints (Engineering) -- Periodicals; Surfaces (Technology) -- Periodicals; 671.52
• DOI: 10.1179/1362171814Y.0000000231
• Languages: English
• ISSNs: 1743-2936

Abstract

<abstract> <title> <x content-type="archive" xml:space="preserve">Abstract</x> </title> <p>Transient liquid phase (TLP) diffusion bonding was carried out on nanostructured metal matrix composite sheets of Al-1100 alloy with 5 wt-% alumina particles at various bonding temperatures and process durations. A thin layer of 5 μm pure copper was electrodeposited as an interlayer. Joint formation was first attributed to the solid state diffusion of copper into the aluminium metal matrix followed by eutectic formation; then, base metal dissolution and isothermal solidification was completed at the joint interface. Joint area was characterised using scanning electron microscopy (SEM) and X-ray diffraction (XRD). Diffraction patterns showed the formation of intermetallic phases like CuAl₂. The concentration of Al₂O₃ particles increases across the interface as the bonding temperature increases. As a result, the highest bond strength of 123 MPa was achieved after a bonding duration of 30 min at 590°C.</p> </abstract>