Cite
HARVARD Citation
Hambuch, M. et al. (n.d.). Joining of Sintered Alumina Substrates and LTCC Green Tapes via Cold Low‐Pressure Lamination. International journal of applied ceramic technology. 11 (3), pp. 443-450. [Online].
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Hambuch, M. et al. (n.d.). Joining of Sintered Alumina Substrates and LTCC Green Tapes via Cold Low‐Pressure Lamination. International journal of applied ceramic technology. 11 (3), pp. 443-450. [Online].