Stress relaxation and failure behavior of Sn–3.0Ag–0.5Cu flip-chip solder bumps undergoing electromigration. Issue 21 (8th September 2014)

Record Type:: Journal Article
Title:: Stress relaxation and failure behavior of Sn–3.0Ag–0.5Cu flip-chip solder bumps undergoing electromigration. Issue 21 (8th September 2014)
Main Title:: Stress relaxation and failure behavior of Sn–3.0Ag–0.5Cu flip-chip solder bumps undergoing electromigration
Authors:: Huang, Mingliang
Zhang, Zhijie
Zhou, Shaoming
Chen, Leida
Abstract:: <abstract abstract-type="graphical"> <title>Abstract</title> <p> <fig position="anchor" orientation="portrait"> <graphic mimetype="image" position="anchor" xlink:href="ark:/27927/pgjhwt2prh" xlink:type="simple" orientation="portrait" xmlns:xlink="http://www.w3.org/1999/xlink" /> </fig> </p> </abstract>
Is Part Of:: Journal of materials research. Volume 29:Issue 21(2014)
Journal:: Journal of materials research
Issue:: Volume 29:Issue 21(2014)
Issue Display:: Volume 29, Issue 21 (2014)
Year:: 2014
Volume:: 29
Issue:: 21
Issue Sort Value:: 2014-0029-0021-0000
Page Start:: 2556
Page End:: 2564
Publication Date:: 2014-09-08
Subjects:: Materials -- Research -- Periodicals
620.1105
Journal URLs:: https://www.springer.com/journal/43578 ↗
http://journals.cambridge.org/action/displayJournal?jid=JMR ↗
http://link.springer.com/ ↗
http://www.mrs.org/ ↗
DOI:: 10.1557/jmr.2014.231 ↗
Languages:: English
ISSNs:: 0884-2914
Deposit Type:: Legaldeposit
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗
Physical Locations:: British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store
Ingest File:: 4372.xml