Cite
HARVARD Citation
Wei, S. et al. (2014). Microstructural evolution and bonding mechanisms of the brazed Ti/ZrO2 joint using an Ag68.8Cu26.7Ti4.5 interlayer at 900 °C. Journal of materials research. 29 (5), pp. 684-694. [Online].
This is an interim version of our Electronic Legal Deposit Catalogue-eJournals and eBooks while we continue to recover from a cyber-attack.
Wei, S. et al. (2014). Microstructural evolution and bonding mechanisms of the brazed Ti/ZrO2 joint using an Ag68.8Cu26.7Ti4.5 interlayer at 900 °C. Journal of materials research. 29 (5), pp. 684-694. [Online].