Thermal Patches: Ultrastretchable and Flexible Copper Interconnect‐Based Smart Patch for Adaptive Thermotherapy (Adv. Healthcare Mater. 5/2015). Issue 5 (April 2015)

• Record Type: Journal Article
• Authors: Hussain, Aftab M.; Lizardo, Ernesto Byas; Torres Sevilla, Galo A.; Nassar, Joanna M.; Hussain, Muhammad M.
• Is Part Of: Advanced healthcare materials. Volume 4:Issue 5(2015)
• Page Start: 664
• Page End: 664
• Publication Date: 2015-04
• Subjects: Biomedical materials -- Periodicals; 610.28
• DOI: 10.1002/adhm.201570030
• Languages: English
• ISSNs: 2192-2640

Abstract

<abstract abstract-type="graphical" xml:lang="en" id="adhm201570030-abs-0001"> <title> <x xml:space="preserve">Abstract</x> </title> <p>Based on the Joule heating principle, a wirelessly controlled thermal patch is developed on page 665 for pain management which uses low‐cost copper as the functional material in a serpentine‐shaped fractal design to vary the size of the patch based on pain location. Complementary metal oxide semiconductor technology is used by M. M. Hussain and co‐workers to fabricate the patch with a heating range up to 103 °C with precise temperature control. <boxed-text content-type="graphic" position="anchor" orientation="portrait"><graphic position="anchor" mimetype="image" xlink:href="ark:/27927/pgjg5cfwv6" orientation="portrait" xlink:type="simple" xmlns:xlink="http://www.w3.org/1999/xlink" /></boxed-text></p> </abstract>