Optimization of the spark plasma sintering processing parameters affecting the properties of polyimide. Issue 9 (6th October 2014)

• Record Type: Journal Article
• Authors: Schwertz, Maxime; Ranque, Pierre; Lemonnier, Sébastien; Barraud, Elodie; Carradò, Adele; Vallat, Marie‐France; Nardin, Michel
• Is Part Of: Journal of applied polymer science. Volume 132:Issue 9(2015:May 05)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2014-10-06
• Subjects: Polymers -- Periodicals; Polymerization -- Periodicals; 668.9
• DOI: 10.1002/app.41542
• Languages: English
• ISSNs: 0021-8995

Abstract

<abstract abstract-type="main"> <title>ABSTRACT</title> <p>The present study deals with the optimization of polyimide (PI) mechanical properties, obtained by Spark Plasma Sintering (SPS), by using a method combining Design of Experiments (DOE) with physical, structural, and mechanical characterizations. The effects of SPS parameters such as temperature, pressure, dwell time, and cooling rate on the density, mechanical properties, and structure of PI were investigated. The experimental results revealed that the mechanical properties of the material were optimized by raising the sintering temperature up to 350°C. The optimized SPS processing parameters were a temperature of 350°C, a pressure of 40 MPa, and a dwell time of 5 min. Under these conditions, a relative density of 99.6% was reached within only a few minutes. The corresponding mechanical properties consisted of Young's modulus of 3.43 GPa, a Shore D hardness of 87.3, and a compressive strength of 738 MPa for a maximum compressive strain of 61.8%. Moreover, when working at 320°C and at 100 MPa, an increase in the dwell time was necessary to enhance the properties. Contrary to the other parameters, the cooling rate appeared to be a non‐significant parameter. Finally, correlations between the PI structure and the mechanical properties were made to demonstrate the densification mechanisms. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. <bold>2015</bold>, <italic>132</italic>, 41542.</p> </abstract>