An Oxygen‐Insensitive Degradable Resist for Fabricating Metallic Patterns on Highly Curved Surfaces by UV‐Nanoimprint Lithography. Issue 19 (3rd September 2014)

• Record Type: Journal Article
• Authors: Hu, Xin; Huang, Shisong; Gu, Ronghua; Yuan, Changsheng; Ge, Haixiong; Chen, Yanfeng
• Is Part Of: Macromolecular rapid communications. Volume 35:Issue 19(2014:Oct.)
• Page Start: 1712
• Page End: 1718
• Publication Date: 2014-09-03
• Subjects: Macromolecules -- Periodicals; Polymers -- Periodicals; Chemistry -- Periodicals; 547.705
• DOI: 10.1002/marc.201400251
• Languages: English
• ISSNs: 1022-1336

Abstract

<abstract abstract-type="main" xml:lang="en"> <title> <x xml:space="preserve">Abstract</x> </title> <p>In this paper, an oxygen‐insensitive degradable resist for UV‐nanoimprint is designed, com­prising a polycyclic degradable acrylate monomer, 2, 10‐diacryloyloxymethyl‐1, 4, 9, 12‐tetraoxa­spiro [4.2.4.2] tetradecane (DAMTT), and a multifunctional thiol monomer pentaerythritol tetra(3‐mercaptopropionate) (PETMP). The resist can be quickly UV‐cured in the air atmosphere and achieve a high monomer conversion of over 98%, which greatly reduce the adhesion force between the resist and the soft mold. High conversion, in company with an adequate Young's modulus (about 1 GPa) and an extremely low shrinkage (1.34%), promises high nanoimprint resolution of sub‐50 nm. The cross‐linked resist is able to break into linear molecules in a hot acid solvent. As a result, metallic patterns are fabricated on highly curved surfaces via the lift off process without the assistance of a thermoplastic polymer layer. <boxed-text content-type="graphic" position="anchor" orientation="portrait"><graphic position="anchor" mimetype="image" xlink:href="ark:/27927/pgh1fd1fz5h" orientation="portrait" xlink:type="simple" xmlns:xlink="http://www.w3.org/1999/xlink" /></boxed-text></p> </abstract>