A robust method of enhancement of protection ability of electrodeposited silane film over copper surface using H2O2. Issue 10 (17th February 2014)

• Record Type: Journal Article
• Authors: Karthik, N.; Sethuraman, M. G.
• Is Part Of: Materials and corrosion. Volume 65:Issue 10(2014:Oct.)
• Page Start: 982
• Page End: 990
• Publication Date: 2014-02-17
• Subjects: Materials -- Periodicals; Metals -- Periodicals; Corrosion and anti-corrosives -- Periodicals; 620.1122305
• DOI: 10.1002/maco.201307396
• Languages: English
• ISSNs: 0947-5117

Abstract

<abstract abstract-type="main"> <title> <x xml:space="preserve">Abstract</x> </title> <sec id="maco201307396-sec-0001" sec-type="section"> <p>The enhancement of protection of copper through pretreatment of metal surface with H₂O₂ and subsequent addition of H₂O₂ in the electrodeposition of 3‐mercaptopropyltrimethoxysilane (MPTS) has been investigated in the present work. MPTS films over copper surface with and without H₂O₂ were investigated by FT‐IR, XRD, Raman spectroscopy and SEM. The protection of copper surface by MPTS in the presence and absence of H₂O₂ in 1% NaCl medium was also investigated by electrochemical impedance spectroscopy (EIS) and potentiodynamic polarization studies (PDS). The results of the study indicate that MPTS film electrodeposited on pretreated copper with 1000 ppm of H₂O₂ increases the inhibition efficiency to almost 100%.</p> </sec> </abstract>