Bio‐Inspired All‐Organic Soft Actuator Based on a π–π Stacked 3D Ionic Network Membrane and Ultra‐Fast Solution Processing. (25th July 2014)

• Record Type: Journal Article
• Authors: Cheedarala, Ravi Kumar; Jeon, Jin‐Han; Kee, Chang‐Doo; Oh, Il‐Kwon
• Is Part Of: Advanced functional materials. Volume 24:Number 38(2014)
• Page Start: 6005
• Page End: 6015
• Publication Date: 2014-07-25
• Subjects: Materials -- Periodicals; Chemical vapor deposition -- Periodicals; 620.11
• DOI: 10.1002/adfm.201401136
• Languages: English
• ISSNs: 1616-301X

Abstract

<abstract abstract-type="main" xml:lang="en"> <title> <x xml:space="preserve">Abstract</x> </title> <p>Next generation electronic products, such as wearable electronics, flexible displays, and smart mobile phones, will require the use of unprecedented electroactive soft actuators for haptic and stimuli‐responsive devices and space‐saving bio‐mimetic actuation. Here, a bio‐inspired all‐organic soft actuator with a π–π stacked and 3D ionic networked membrane based on naphthalene‐tetracarboxylic dianhydride (Ntda) and sulfonated polyimide block copolymers (SPI) is presented, utilizing an ultra‐fast solution process. The π–π stacked and self‐assembled 3D ionic networked membrane with continuous and interconnected ion transport nanochannels is synthesized by introducing simple and strong atomic level regio‐specific interactions of hydrophilic and hydrophobic SPI co‐blocks with cations and anions in the ionic liquid. Furthermore, a facile and ultrafast all‐solution process involving solvent blending, dry casting, and solvent dropping is developed to produce electro‐active soft actuators with highly conductive polyethylenedioxythiophene (PEDOT):polystyrenesulfonate (PSS) electrodes. Ionic conductivity and ion exchange capacity of the π–π stacked Ntda‐SPI membrane can be increased up to 3.1 times and 3.4 times of conventional SPI, respectively, resulting in a 3.2 times larger bending actuation. The developed bio‐inspired soft actuator is a good candidate for satisfying the tight requirements of next generation soft electronic devices due to its key benefits such as low operating voltage and comparatively large strains, as well as quick response and facile processability.</p> </abstract>