Preparation of β‐SiCw/BDM/DBA composites with excellent comprehensive properties. Issue 10 (15th January 2014)

• Record Type: Journal Article
• Authors: Dang, Jing; Wang, Rumin; Yang, Li; Gao, Lihong; Zhang, Zhang; Zha, Meng
• Is Part Of: Polymer composites. Volume 35:Issue 10(2014:Oct.)
• Page Start: 1875
• Page End: 1878
• Publication Date: 2014-01-15
• Subjects: Polymeric composites -- Periodicals; 620.192
• DOI: 10.1002/pc.22843
• Languages: English
• ISSNs: 0272-8397

Abstract

<abstract abstract-type="main"> <title> <x xml:space="preserve">Abstract</x> </title> <p>Functionalized β‐SiC whiskers (β‐SiCw) are employed to prepare β‐SiCw/<italic>N</italic>, <italic>N</italic>′‐4, 4′‐bimaleimide diphenyl methane/diallylbisphenol A (β‐SiCw/BDM/DBA) composites via powder blending‐casting method. The thermal conductive coefficient of the β‐SiCw/BDM/DBA composites is 0.994 W/mK with 40 wt% functionalized β‐SiCw, five times higher than that of pure BDM/DBA. The mechanical properties of the β‐SiCw/BDM/DBA composites are optimal with 10 wt% functionalized β‐SiCw. Both thermal resistance and dielectric constant are increased with the increasing addition of β‐SiCw. For a given β‐SiCw loading, the surface functionalization of β‐SiCw exhibits a positive effect on the thermal conductivities and mechanical properties of the β‐SiCw/BDM/DBA composites. POLYM. COMPOS., 35:1875–1878, 2014. © 2014 Society of Plastics Engineers</p> </abstract>