Failure Analysis and Reliability of Low-Temperature-Grown Multi-Wall Carbon Nanotube Bundles Integrated as Vias in Monolithic Three-Dimensional Integrated Circuits. (August 2014)

Record Type:
Journal Article
Title:
Failure Analysis and Reliability of Low-Temperature-Grown Multi-Wall Carbon Nanotube Bundles Integrated as Vias in Monolithic Three-Dimensional Integrated Circuits. (August 2014)
Main Title:
Failure Analysis and Reliability of Low-Temperature-Grown Multi-Wall Carbon Nanotube Bundles Integrated as Vias in Monolithic Three-Dimensional Integrated Circuits
Authors:
Chiaramonti, Ann N.
Vollebregt, Sten
Sanders, Aric W.
Ishihara, Ryoichi
Read, David T.
Abstract:
Is Part Of:
Microscopy and microanalysis. Volume 20:Number 3(2014:Jun.)
Journal:
Microscopy and microanalysis
Issue:
Volume 20:Number 3(2014:Jun.)
Issue Display:
Volume 20, Issue 3 (2014)
Year:
2014
Volume:
20
Issue:
3
Issue Sort Value:
2014-0020-0003-0000
Page Start:
1762
Page End:
1763
Publication Date:
2014-08
Subjects:
Microscopy -- Periodicals
Microchemistry -- Periodicals
502.82
Journal URLs:
https://academic.oup.com/mam ↗
http://journals.cambridge.org/action/displayJournal?jid=MAM ↗
http://link.springer.de/link/service/journals/10005/index.htm ↗
http://firstsearch.oclc.org ↗
DOI:
10.1017/S143192761401054X ↗
Languages:
English
ISSNs:
1431-9276
Deposit Type:
Legaldeposit
View Content:
Available online (eLD content is only available in our Reading Rooms) ↗
Physical Locations:
British Library HMNTS - ELD Digital store
Ingest File:
3380.xml