Beware of Artifacts When Characterizing Nanometer Device Features Smaller than a TEM Lamella Thickness in Semiconductor Wafer-foundries. (August 2014)

Record Type:: Journal Article
Title:: Beware of Artifacts When Characterizing Nanometer Device Features Smaller than a TEM Lamella Thickness in Semiconductor Wafer-foundries. (August 2014)
Main Title:: Beware of Artifacts When Characterizing Nanometer Device Features Smaller than a TEM Lamella Thickness in Semiconductor Wafer-foundries
Authors:: Zhao, Wayne
Porter, Hugh
Rai, Raghaw
Chen, Esther (PY)
Russell, Jeremy
Abstract:
Is Part Of:: Microscopy and microanalysis. Volume 20:Number 3(2014:Jun.)
Journal:: Microscopy and microanalysis
Issue:: Volume 20:Number 3(2014:Jun.)
Issue Display:: Volume 20, Issue 3 (2014)
Year:: 2014
Volume:: 20
Issue:: 3
Issue Sort Value:: 2014-0020-0003-0000
Page Start:: 1000
Page End:: 1001
Publication Date:: 2014-08
Subjects:: Microscopy -- Periodicals
Microchemistry -- Periodicals
502.82
Journal URLs:: https://academic.oup.com/mam ↗
http://journals.cambridge.org/action/displayJournal?jid=MAM ↗
http://link.springer.de/link/service/journals/10005/index.htm ↗
http://firstsearch.oclc.org ↗
DOI:: 10.1017/S1431927614006722 ↗
Languages:: English
ISSNs:: 1431-9276
Deposit Type:: Legaldeposit
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗
Physical Locations:: British Library HMNTS - ELD Digital store
Ingest File:: 3375.xml