More Moore meets More than Moore: Enabling healthcare applications. Issue 1 (9th December 2013)

• Record Type: Journal Article
• Authors: Brongersma, Sywert H.; Blauw, Michiel; Zevenbergen, Marcel; Karabacak, Devrez; Vitushinsky, Roman; Dam, Van Anh; Calama, Mercedes Crego; Vullers, Rudolf; Zeng, Zeng; Schaijk, Rob van; Cristiano, Fuccio; Pichler, Peter; Tavernier, Clément; Windl, Wolfgang
• Is Part Of: Physica status solidi. Volume 11:Issue 1(2014:Jan.)
• Page Start: 46
• Page End: 49
• Publication Date: 2013-12-09
• Subjects: Solid state physics -- Congresses; Solid state physics -- Periodicals; Solid state physics; Conference proceedings; Periodicals; 530.41
• DOI: 10.1002/pssc.201300182
• Languages: English
• ISSNs: 1862-6351

Abstract

<abstract abstract-type="main" xml:lang="en"> <title>Abstract</title> <p>Western societies all see their healthcare costs outpace GDP growth. To reverse this trend, several public and private initiatives were taken in the last years to make healthcare more cost efficient. It is anticipated that micro and nano‐system technology will help enable an increase in the functionality of lifestyle and healthcare devices to gradually reduce cost. This builds on the scaling of microelectronics that additionally provides opportunities for reducing both form factor and power requirements. In the next decade, body area network technology will be one of the advancements that provides medical, lifestyle, assisted living, sports or entertainment functions for the user. Such a network comprising a series of miniature sensor nodes, implanted or located around the body should be able to communicate with other sensor nodes and/or with a gateway node that provides a connection to the outside world using a standard telecommunication infrastructure. Early deployment of technology in different application cases are translated into critical technology obstacles that need to be solved in order to enable widespread deployment. For the development of smaller and smarter systems with ever increasing autonomy, key technological challenges are addressed at the level of sensors, energy harvesting, ultra‐low‐power DSP, wireless connectivity, and integration and packaging. (© 2014 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)</p> </abstract>