Cite
HARVARD Citation
Song, K. et al. (n.d.). Relationship between interfacial stress and thermal expansion coefficient of copper–matrix composites with different reinforced phases. Materials science and technology. pp. 171-175. [Online].
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Song, K. et al. (n.d.). Relationship between interfacial stress and thermal expansion coefficient of copper–matrix composites with different reinforced phases. Materials science and technology. pp. 171-175. [Online].