Fracture Toughness Healing in Epoxy Containing Both Epoxy and Amine Loaded Capsules1. Issue 5 (20th January 2014)

• Record Type: Journal Article
• Authors: Neuser, Sam; Chen, Philipp W.; Studart, André. R.; Michaud, Véronique; Zschech, Ehrenfried
• Is Part Of: Advanced engineering materials. Volume 16:Issue 5(2014:May)
• Page Start: 581
• Page End: 587
• Publication Date: 2014-01-20
• Subjects: Materials -- Periodicals; 620.11
• DOI: 10.1002/adem.201300422
• Languages: English
• ISSNs: 1438-1656

Abstract

<abstract abstract-type="main" xml:lang="en"> <title> <x xml:space="preserve">Abstract</x> </title> <sec id="adem201300422-sec-0001" sec-type="section"> <p>The feasibility of self‐healing epoxy matrices using the same chemistry as the matrix material, namely a standard epoxy‐amine system, is demonstrated. The two‐component self‐healing system is encapsulated in core‐shell structures using standard in situ curing in a stirred emulsion and a novel microfluidic encapsulation technique for the epoxy monomer and the amine hardener, respectively. The recovery of fracture toughness after room temperature healing is above 50%, and increases to 100% when shape memory alloy wires are combined with a low temperature cure of the matrix to enhance crack closure. This healing ability is also preserved for higher curing temperatures, demonstrating the potential of this novel approach.</p> </sec> </abstract>