An Experimental Approach to Enhance Cu Wire Bonding Yield Through Parameter Optimization. Issue 3 (16th December 2011)

• Record Type: Journal Article
• Authors: Su, C.‐T.; Yeh, C.‐J.; Chou, C.‐J.; Chang, C. Alec
• Is Part Of: Experimental techniques. Volume 38:Issue 3(2014)
• Page Start: 29
• Page End: 36
• Publication Date: 2011-12-16
• Subjects: Materials -- Testing -- Periodicals; Strains and stresses -- Periodicals; Engineering instruments -- Periodicals; 620.1
• DOI: 10.1111/j.1747-1567.2011.00799.x
• Languages: English
• ISSNs: 0732-8818

Abstract

<abstract abstract-type="main" xml:lang="en"> <title> <x xml:space="preserve">Abstract</x> </title> <p>Gold (Au) wire is the preferred material for wire bonding in the semiconductor industry. However, the rising price of Au has become a key issue in IC assembly and design. To stay competitive, costs must be reduced. Copper (Cu) wire can also be used in wire bonding. Cu wire is cheaper than Au wire. To obtain the best yield of wire bonding and to reduce cost, this study develops an experimental approach by utilizing neural networks to establish the functional relationship between control factors and responses and then applying genetic algorithms to obtain the optimal control factor settings of the Cu wire bonding process. Using the developed approach for Cu wire bonding parameter design, the production yield increased from 98.5 to 99.65%, resulting in approximately USD 1.16 million in savings.</p> </abstract>