Back Cover: Stabilization of Copper Catalysts for Liquid‐Phase Reactions by Atomic Layer Deposition (Angew. Chem. Int. Ed. 51/2013). Issue 51 (28th November 2013)

• Record Type: Journal Article
• Authors: O'Neill, Brandon J.; Jackson, David H. K.; Crisci, Anthony J.; Farberow, Carrie A.; Shi, Fengyuan; Alba‐Rubio, Ana C.; Lu, Junling; Dietrich, Paul J.; Gu, Xiangkui; Marshall, Christopher L.; Stair, Peter C.; Elam, Jeffrey W.; Miller, Jeffrey T.; Ribeiro, Fabio H.; Voyles, Paul M.; Greeley, Jeffrey; Mavrikakis, Manos; Scott, Susannah L.; Kuech, Thomas F.; Dumesic, James A.
• Is Part Of: Angewandte Chemie international edition. Volume 52:Issue 51(2013)
• Page Start: 13824
• Page End: 13824
• Publication Date: 2013-11-28
• Subjects: Chemistry -- Periodicals; 540
• DOI: 10.1002/anie.201309934
• Languages: English
• ISSNs: 1433-7851

Abstract

<abstract abstract-type="graphical" xml:lang="en"> <title> <x xml:space="preserve">Abstract</x> </title> <p>Deactivation of heterogeneous catalysts is an important issue in liquid‐phase catalytic processes and for the utilization of base metal catalysts, such as copper. In their Communication on <ext-link ext-link-type="doi" xlink:type="simple" xmlns:xlink="http://www.w3.org/1999/xlink">page 13808 ff., </ext-link> J. A. Dumesic et al. show that atomic layer deposition can be used to build a protective coating around metallic nanoparticles, thereby preventing irreversible catalyst deactivation during liquid‐phase catalytic processing.<boxed-text content-type="graphic" position="anchor" orientation="portrait"><graphic position="anchor" mimetype="image" xlink:href="ark:/27927/pgg4t3jdmjt" orientation="portrait" xlink:type="simple" xmlns:xlink="http://www.w3.org/1999/xlink" /></boxed-text></p> </abstract>