Anisotropic Colloidal Templating of 3D Ceramic, Semiconducting, Metallic, and Polymeric Architectures. (23rd December 2013)

• Record Type: Journal Article
• Authors: Fu, Ming; Chaudhary, Kundan; Lange, Jonathan G.; Kim, Ha Seong; Juarez, Jamie J.; Lewis, Jennifer A.; Braun, Paul V.
• Is Part Of: Advanced materials. Volume 26:Number 11(2014)
• Page Start: 1740
• Page End: 1745
• Publication Date: 2013-12-23
• Subjects: Materials -- Periodicals; Chemical vapor deposition -- Periodicals; 620.11
• DOI: 10.1002/adma.201304809
• Languages: English
• ISSNs: 0935-9648

Abstract

<abstract abstract-type="graphical" xml:lang="en" id="adma201304809-abs-0001"> <title> <x xml:space="preserve">Abstract</x> </title> <p> <bold>3D‐porous anisotropic solids</bold> are fabricated by using horizontally and vertically aligned assemblies of silica rods with a length of ca. 2 μm and a diameter of 500 nm as templates. Templated materials include examples from metals, semiconductors, ceramics, and polymers, Ni, Si, HfO₂, and PMMA, respectively. By varying the infilling conditions, the detailed mesoscale structure and degree of anisotropy can be controlled. <boxed-text content-type="graphic" position="anchor" orientation="portrait"><graphic position="anchor" mimetype="image" xlink:href="ark:/27927/pgg4sr6ppcz" orientation="portrait" xlink:type="simple" xmlns:xlink="http://www.w3.org/1999/xlink" /></boxed-text></p> </abstract>