Toughening Thin‐Film Structures with Ceramic‐Like Amorphous Silicon Carbide Films. Issue 2 (25th July 2013)

• Record Type: Journal Article
• Authors: Matsuda, Yusuke; Ryu, Ill; King, Sean W.; Bielefeld, Jeff; Dauskardt, Reinhold H.
• Is Part Of: Small. Volume 10:Issue 2(2014:Jan.)
• Page Start: 253
• Page End: 257
• Publication Date: 2013-07-25
• Subjects: Nanotechnology -- Periodicals; Nanoparticles -- Periodicals; Microtechnology -- Periodicals; 620.5
• DOI: 10.1002/smll.201300130
• Languages: English
• ISSNs: 1613-6810

Abstract

<abstract abstract-type="graphical" xml:lang="en" id="smll201300130-abs-0001"> <title> <x xml:space="preserve">Abstract</x> </title> <p> <bold>A significant improvement of adhesion in thin‐film structures</bold> is demonstrated using embedded ceramic‐like amorphous silicon carbide films (a‐SiC:H films). a‐SiC:H films exhibit plasticity at the nanoscale and outstanding chemical and thermal stability unlike most materials. The multi‐functionality and the ease of processing of the films have potential to offer a new toughening strategy for reliability of nanoscale device structures. <boxed-text content-type="graphic" position="anchor" orientation="portrait"><graphic position="anchor" mimetype="image" xlink:href="ark:/27927/pgg4sqp7vc4" orientation="portrait" xlink:type="simple" xmlns:xlink="http://www.w3.org/1999/xlink" /></boxed-text></p> </abstract>