Influence of dual‐RRA temper on the exfoliation corrosion and electrochemical behavior of Al–Zn–Mg–Cu alloy. Issue 4 (9th August 2011)

• Record Type: Journal Article
• Authors: Peng, G.‐S.; Chen, K.‐H.; Chen, S.‐Y.; Fang, H.‐C.
• Is Part Of: Materials and corrosion. Volume 64:Issue 4(2013:Apr.)
• Page Start: 284
• Page End: 289
• Publication Date: 2011-08-09
• Subjects: Materials -- Periodicals; Metals -- Periodicals; Corrosion and anti-corrosives -- Periodicals; 620.1122305
• DOI: 10.1002/maco.201106234
• Languages: English
• ISSNs: 0947-5117

Abstract

<abstract abstract-type="main" xml:lang="en"> <title>Abstract</title> <p>Influence of dual‐retrogression and reaging (dual‐RRA) temper on the exfoliation corrosion (EC) and electrochemical behavior of Al–Zn–Mg–Cu alloy has been investigated by means of transmission electron microscope, energy dispersive X‐ray spectroscopy, tensile test, polarization curve, and EIS. Dual‐RRA temper not only kept the strength similar to retrogression and reaging temper, but also improved EC resistance compared to T76 temper, being attributed to coarser and sparser grain boundary precipitates as well as higher Cu and lower Zn content. Obtained polarization curves and EIS are in good agreement with EC rating sequence.</p> </abstract>