Deposition of Ti-Si-N films on Al substrates by magnetron sputtering. (1st November 2013)

• Record Type: Journal Article
• Authors: Pang, J; Bai, Y; Qin, F; Pan, L; Zhao, Y; Kang, R
• Is Part Of: Surface engineering. Volume 29:Number 10(2013)
• Page Start: 749
• Page End: 754
• Publication Date: 2013-11-01
• Subjects: Surfaces (Technology) -- Periodicals; Coatings -- Periodicals; 620.4405
• DOI: 10.1179/1743294413Y.0000000178
• Languages: English
• ISSNs: 0267-0844

Abstract

<abstract> <title> <x xml:space="preserve">Abstract</x> </title> <p>The objective of this work is to settle the problem of adhesion between hard films and soft metal substrates. Hard Ti-Si-N films were deposited onto soft Al substrates with a double target magnetron sputtering system. The composition, structure, surface morphologies and mechanical properties were characterised by electron probe microanalyser, X-ray diffraction, atomic force microscope, scratch test and nanoindentation respectively. The as-deposited films had good adhesion to the Al substrates and had a smooth and lustrous surface. The maximum hardness of the films achieved was as high as 27·2 GPa at the Si target power of 80 W.</p> </abstract>